High Density Interconnect PCB Fabrication

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Cirexx has the capabilities and experience to take on all jobs — including high density interconnect (HDI) fabrication and manufacturing. HDI PCBs have become increasingly popular and are used in a wide variety of industries, including medical, military, and aerospace. They are found most notably in smartphones, tablets, and other digital devices.

Our state-of-the-art facility is located in Silicon Valley, and as a leading HDI PCB manufacturer, we continue to invest in the most sophisticated production and testing equipment and technology. At Cirexx, we have the deep engineering experience to handle complex jobs with incredible accuracy — on time and on budget.

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HDI PCBs are characterized by thin lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser-drilled microvias, sequential lamination, and via in-pads.

We use the most advanced equipment and technology, including laser direct imaging, to hold tight tolerances so that we can meet today’s HDI PCB requirements.

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Our experienced engineers have also worked with every type of PCB material, so they have the knowledge and expertise to provide recommendations and answer all of your HDI PCB questions. Most importantly, they know how to assist for manufacturability and the potential cost drivers of a project.

Back drilling – A method of disconnecting part of the plated through hole from other layers inside, which is something many of our competitors don’t do.
Controlled depth drilling/milling
Buried capacitance – This technology can increase the performance of printed circuit boards through improved signal integrity. This process incorporates a very thin dielectric layer that provides distributive decoupling capacitance.
Hole tolerances – With our advanced technology drilling equipment, we’re able to hold very tight hole tolerances and hole locations. This is importance because these holes have multiple functions, including through-hole connector insulation and preventing signal leakage.
Fine pitch – Down to .3mm

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We continue to invest in the most sophisticated production equipment, which includes laser direct imaging (LDI) equipment. In addition, Cirexx currently has four dual-headed lasers for via forming of blind and buried vias, laser ablated pockets, and precision routing of flex circuits, which is the greatest number in any North American PCB manufacturing facility.

We differentiate ourselves by being able to take on all projects — all the way from layout through assembly — and we do this under one roof. Our engineers are up to date on the latest technologies, and we have vast experience and knowledge to ensure that your orders are produced on time and within your budget.

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Custom HDI PCB fabrication in as little as 5-15 days – all you have to do is ask
Interactive digital systems in place to assure rapid quoting, order entry, engineering, tooling, fabrication, testing, and shipping
All in-house fabrication of standard PCB processing – no outsourcing
Total control of build time and product quality
One of the few manufacturers who offers fully certified class 3, class 3DS, MIL PRF 31032 military defense products in a quick turn mode
Our philosophy is, “If you have a challenge, bring it on!”

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We have earned a wide variety of certifications and registrations that allow us to work with any industry.

AS9100

The Aerospace PCB quality standard

ISO 9001

Provides general quality assurance guidelines

Military

MIL-PRF-31032 1-4 55110, and 50884

J-STD-001 ES

Standard quality for aerospace, military, and medical work

ITAR

Fully vetted ITAR staff that is trained when it comes ti ITAR rules and regulations

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If you have an HDI PCB fabrication job that needs to be done in a hurry, look no further than Cirexx. We have impressive quick turn PCB capabilities — including top engineers and state-of-the-art technology — to meet your tough project deadlines and budgets. Depending on the complexity of your project, we can provide a quick turn PCB fabrication in as little as 24 hours.

Our quick turn capabilities include:

– 1-5 day turnarounds

– Fully certified defense capabilities

– No outsourcing

– Rapid quoting, order entry, engineering, tooling, fabrication, testing, and shipping

– Total control of build time and product quality

Quick Turn HDI PCB Fabrication & Manufacturing

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Design & Test

Trace Tolerance

+/- .0008"

Internal Drill to Cµ

.007"

Pad Over FHS .004"

.004"

Solder mask clearance over pad size

.005"

From Cµ to the edge of the board

.010"

Impedance

+/- 10%

Lamination

Board Thickness

+/- 8%

Layer to layer registration +/-

.005" Lower depending on layer count

Drill & Route

Route

+/- .005" Lower tolerances available

Inside Radius

.015"

Minimum Slot Width

.021"

Drill positioning

.002"